MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202617089678 A) filed by Kao Corporation on July 23, 2026, for Composition For Mold.
Inventors include Tanaka,hiroki; Matsuo,toshiki; and Yamaguchi,daisuke.
The application for the patent was published on October 23, 2026, under issue no. 43/2026.
Abstract: The present invention pertains to a composition for a mold, the composition comprising an acid-curable resin, a curing agent for curing the acid-curable resin, and refractory particles, wherein the curing agent contains an aromatic sulfonic acid (A), and the average total number of carbon atoms, per molecule of the aromatic sulfonic acid (A), of an alkyl group of the aromatic sulfonic acid (A) contained in the curing agent is more than 2.0 and at most 11.0. The present invention can provide: a composition which is for a mold and is capable of suppressing a decrease in mold strength in a low-temperature environment without increasing a sulfur content; a curing agent composition for shaping a mold; and a mold manufacturing method.
Disclaimer: Curated by HT Syndication.
