MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202647066731 A) filed by Nippon Soda Co. , Ltd. on May 27, 2026, for Composition For Insulating Layer Of Printed Wiring Board.
Inventors include Kawanishi, Takuya; Yamate, Taiki; Saito, Mizuki; and Shibata, Yasuhisa.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: The present invention addresses the problem of providing a composition for use in an insulating layer of a printed wiring board, said composition having a low dielectric constant, a low dielectric loss tangent, and flame retardancy. This resin composition for use in an insulating layer of a printed wiring board includes a polybutadiene, wherein the molar ratio of 1,2 bond structures to 1,4 bond structures in the polybutadiene is 60:40 to 100:0, and bonded to at least one carbon atom in the polybutadiene is a phosphorus-including group represented by formula (III) (in formula (III), * represents a bond location, X1 and X2 each independently represent a single bond or an oxygen atom, and R1 and R2 each independently represent an organic group).
Disclaimer: Curated by HT Syndication.
