MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202617075162 A) filed by Plasma Innovations Gmbh on June 17, 2026, for Composite Material For Manufacturing Printed Circuit Boards, And Manufacturing Method.
Inventors include Bisges, Michael; and Henze, Enno Klaus.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: The invention relates to a composite material for manufacturing printed circuit boards, offering advantages in terms of cost, weight, and availability compared to the conventionally used copper-clad laminate (CCL), the composite material comprising: - a planar carrier having a first and a second side, at least the two sides consisting of an electrically insulating material; - an aluminium foil which is integrally bonded to one of the two sides of the carrier; and - a solderable metal coating which is arranged exclusively on the side of the aluminium foil facing away from the carrier, contains copper or nickel or silver or gold, has a maximum layer thickness of 25 µm, and at least partially covers the aluminium foil. The invention also relates to a method for manufacturing the composite material.
Disclaimer: Curated by HT Syndication.
