MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202641076722 A) filed by National Institute Of Technology, Calicut on June 21, 2026, for Compact Modular Enclosure For Embedded Edge Computing Devices And Related Methods.
Inventors include K. A. V Sridhar; Dr. Devesh Shukla; and C Charan Kumar.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: [0070] A modular enclosure for embedded edge computing devices is described, featuring a housing body designed to accommodate electronic components and access openings. The enclosure includes a lid panel pivotally connected to the housing body, allowing for the mounting of a display. A hinge assembly with support brackets and hinge-lug tabs enables the lid panel to tilt, while an angle support arm provides adjustable bracing. The components are designed for fabrication using Fused Deposition Modeling 3D printing. The housing body includes internal mounting posts for securing a single-board computer and a portable power bank. The method of manufacturing involves 3D printing the components and assembling them to form the enclosure.
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