MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202611089641 A) filed by Indian Institute Of Technology Jodhpur on July 23, 2026, for Cold Workable Near Refractory Ti-Rich Complex Lean Alloy And Its Preparation Method Thereof.
Inventors include Nene, Saurabh Sanjay; Balpande, Aditya Rameshwar; and Dutta, Akshit.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: The present invention relates to a low-density, oxidation-resistant Ti-rich complex lean alloy (CLA) comprising Ti-Al-Mo-Nb-V-Ta-W, which belongs to the field of metallurgy and materials, and a subsequent preparation method for it. Specifically, it discloses a novel Ti-rich complex lean alloy denoted as Ti70[Al10Mo7.5Nb5V3W2.5Ta2] CLA, where the number in the subscript after every element is the atomic per cent (at.%) of the element in the composition. The novel Ti-rich CLA with excellent room-temperature rollability, resulting in high-temperature strength and ductility under tension and compression at room temperature, while also exhibiting excellent high-temperature oxidation resistance.
Disclaimer: Curated by HT Syndication.
