MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202521004817 A) filed by Lsp Innovations LLP on January 21, 2025, for Cold-Cum-Cold-Proof Panels, Accessories And Uses Thereof.
Inventors include Dharmaraj N. Patil; Chetan Dharmaraj Patil; and Supriya Dharmaraj Patil.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: ABSTRACT Cold-cum-cold-proof panels, accessories and their installation The invention relates to a cold-cum-cold-proof panel (100) comprising one or more baked clay hollow core panels having one or more hollow cores, water inlets (2) and/or water outlets (3). In particular, the panels may include hollow core clay blocks (8, 9, 10), hollow core block panels (1, 4, 12, 14, 19), baked clay frames (20, 23), baked clay tiles/sheets (21), hollow core baked frame panels (24), hollow core baked clay pipes (29), hollow core baked clay pipe panels (29, 30, 32), baked clay corrugated sheets (33) and/or hollow core clay corrugated panels (34). The panels may be either made of baked clay only and/or reinforced and/or reinforced with one or more steel wires, metal wire mesh, perforated metal sheets and/or fire-retardant threads. The hollow core of the panels may be filled with water during summer season and/or vented during winter season, keeping the interior area of the structure cool and/or warm. Fig. 1, 5B, 6F, 7F and 10D
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