MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617055225 A) filed by Corning Incorporated on April 30, 2026, for Coated Articles With A Planarization Layer/Hydroxyl-Modified Layer And A Surface-Modifying Layer And Methods Of Making The Same.
Inventors include Adib, Kaveh; Bellman, Robert Alan; Brown, Philip Simon; Cushman, Cody Vic; and Fuller, Brandy Wright.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: Coated articles are described herein that include a first layer. The first layer may comprise a planarization layer and/or a hydroxyl-modified layer. The planarization layer includes a silica or a partial silica-like having Si-O-Si-O bonds. The coated article further includes a surface-modifying layer disposed on a first surface area of the first layer. In aspects, the first layer has a molar ratio of hydrogen to silicon of about 0.2 or more. Methods of forming coated articles can include evaporating a functionalized polyhedral oligomeric silsesquioxane and impinging an ion beam thereon to from a planarization layer. Methods for forming coated articles can include impinging a plasma at a first major surface of a substrate to form a hydroxyl-modified layer.
Disclaimer: Curated by HT Syndication.
