Intellectual Property India Publishes Patent Application for Chip Package With Multiple Hbm Stacks

MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202617059058 A) filed by Advanced Micro Devices, Inc. on May 08, 2026, for Chip Package With Multiple Hbm Stacks.

Inventors include Wilkerson, Brett P.; and Smith, Alan D..

The application for the patent was published on June 12, 2026, under issue no. 24/2026.

Abstract: Disclosed herein are chip packages that integrate multiple compute dies through a single interposer die to a memory stack. The interposer die includes memory controller circuitry that allowing multiple compute dies to access the memory stack in an efficient manner.

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