MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202647068618 A) filed by Advanced Micro Devices, Inc. on June 01, 2026, for Chip Package With Active Silicon Bridge.
Inventors include Kulkarni, Deepak Vasant; Smith, Alan D.; and Swaminathan, Raja.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: Disclosed herein are chip packages and electronic devices that utilized an active silicon bridge having a memory controller to interface between a logic device having at least one compute die and one or more memory stacks within a singular chip package. In one example, a chip package is provided that includes a substrate, a logic device, a memory stack, and an active silicon bridge. The logic device is disposed over the substrate. The logic device includes one or more compute dies. The memory stack is disposed over the substrate adjacent the logic device. The active silicon bridge has a first portion and a second portion. The first portion is disposed between the substrate and the logic device, while the second portion is disposed between the substrate and the memory stack.
Disclaimer: Curated by HT Syndication.
