MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202627001340 A) filed by Huawei Technologies Co. , Ltd. on January 06, 2026, for Chip, Chip Manufacturing Method, Computing Device, And Signal Transmission Method.
Inventors include Xu, Yahan; Peng, Xiping; and Fu, Junhao.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: A chip, a chip manufacturing method, a computing device, and a signal transmission method. A packaging substrate of the chip comprises a basic pattern unit having six signal pins, wherein a first pin, a second pin, a third pin and a fourth pin are sequentially arranged at intervals in a first direction, and a fifth pin and a sixth pin are arranged at an interval in a second direction; the fifth pin and the sixth pin are respectively located on two sides of a connecting line of the second pin and the third pin; and the first pin, the fourth pin, the fifth pin and the sixth pin are data signal pins, and the second pin and the third pin are control signal pins. According to the solution, the data signal pins are respectively arranged at four outwards-extending ends of the cross-shaped pattern unit, the data signal pins are far away from each other, and each data signal pin does not have an adjacent data signal pin capable of forming a crosstalk source, effectively reducing electromagnetic crosstalk between pins; additionally, the density of the arrangement of the pins can be improved, reducing the packaging area.
Disclaimer: Curated by HT Syndication.
