MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202647102041 A) filed by Tetra Laval Holdings & Finance S. A. on August 24, 2026, for Cap Application Device And Method For Applying Caps To Sealed Packages.
Inventors include Bellesia, Simone; Bortolotti, Edoardo; and Marino, Alessandro.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: There is described a cap application device (14) for a capping apparatus (13) of a packaging machine (1) configured to produce sealed packages (2) containing a pourable product and each provided with a respective pouring collar (5), the cap application device (14) is configured to apply caps (6) onto the respective collars (5) of such packages (2) and comprises: a conveyor (15) configured to advance a succession of packages (2) along an advancement path (P) for conveying each collar (5) through an application station (A); a feeding unit (16) configured to sequentially feed the caps (6) towards the application station (A), at which the caps (6) are released from the feeding unit (16) to be applied onto respective collars (5); the feeding unit (16) is movable for automatically adjusting the position at which said caps (6) are released, and/or the position of the application station (A), with respect to the advancement path (P).
Disclaimer: Curated by HT Syndication.
