MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202617069974 A) filed by Belden Canada Ulc on June 04, 2026, for Cable Adapter Structurally Configured To Augment A Cable Diameter To Enhance Attachment With A Component.
Inventors include Carboni, Massimo, P.; and Levy, Moise.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: A cable adapter may include a body portion configured to include a cable receiving portion and a cable gripping portion. The cable receiving portion may include a longitudinal bore extending from a first end of the body portion to a second end of the body portion, and the cable receiving portion may be configured to receive a portion of a cable from a lateral side of the body portion. The body portion may be structurally configured to engage a grooved portion of an outer surface of a jacket of a cable, and wherein the body portion is configured to receive a gripping portion of a component of a telecommunications network, such that the body portion is structurally configured to augment an outer diameter of a cable received in the cable receiving portion such that the cable is configured to be coupled with the component at an opening of the component having a diameter that is larger than an outer diameter of the cable so as to provide enhanced attachment of the cable to the component.
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