MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202641057563 A) filed by Saveetha Institute Of Medical And Technical Sciences on May 06, 2026, for C-Diab - Heal - Poly Spray Formulation And Diabetic Wound Healing Evaluation.
Inventors include Dr. Chella Perumal Palanisamy; Dr. Gopalakrishn An Velliyur Kanniappan; Dr Selvaraj Jayaraman; Vinoth Kumar Dhayalan; Dr. Raj Kumar Thamarai; Niranjan Balaji; Nithin Ravikumar; Dr. Nisha B.; and Deepak Nallaswamy Veeraiyan.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: ABSTRACT OF THE INVENTION The invention discloses a novel C-Diab-Heal-Poly Spray formulation, intended for effective treatment of diabetic wounds characterized by delayed healing and high infection risk. The fonnulation comprises a biocompatible polymeric base combined with therapeutic agents (metallic nanoparticles) and functional additives that enable rapid spray application and in situ film formarion over Ihe wound suiface. The spray promotes accelerated wound closure by enhancing .-c.ellular_migratiun, angiogenesis and cxt.racdlular matjix remodeling while simultaneously inhibiting microbial colonization. The formulation exhibits excellent adhesion, sustained therapeutic release, and minimal cytotoxicity, making it suitable for chronic diabetic wound care in both clinical and home-based settings.i
Disclaimer: Curated by HT Syndication.
