MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088348 A) filed by Qualcomm Incorporated on July 20, 2026, for Buried Bump Structure.
Inventors include We, Hong Bok; Buot, Joan Rey Villarba; Lee, Sang-Jae; and Wang, Zhijie.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: In an aspect, an apparatus includes a die including a plurality of die connectors. The apparatus may include a package substrate including a first metallization structure disposed below the die, the first metallization structure includes: a plurality of dielectric layers, a plurality of metal layers disposed in the plurality of dielectric layers, a plurality of vias configured to couple adjacent metal layers of the plurality of metal layers through the plurality of dielectric layers; and a plurality of buried bump structures disposed in a top dielectric layer of the plurality of dielectric layers, wherein the plurality of buried bump structures is directly coupled to the plurality of die connectors.
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