MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617056973 A) filed by Kemira Oyj on May 05, 2026, for Biodegradable Composition And Low-Temperature Film-Forming Process Using Same.
Inventors include Chen, Xiaoyu; Yan, Jiasong; Li, Fengyang; and Xiao, Lan.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: The present invention relates to the technical field of film-forming compositions. In particular, the present invention relates to a biodegradable composition and a low- temperature film-forming process using same. The biodegradable composition of the present invention comprises a biodegradable polymer, a surfactant, a cross-linking agent, and a first additive.
Disclaimer: Curated by HT Syndication.
