MUMBAI, India, Oct. 12 -- Intellectual Property India has published a patent application (202631007463 A) filed by Royal Bengal Greentech Private Limited on January 26, 2026, for Biodegradable, Latex-Free Adhesive Composition And The Method Thereof.
Inventors include Gautam Basu; Ms. Pallavi Luharuka; Dr. Rahul Chatterjee; and Mr. Arghya Basak.
The application for the patent was published on October 09, 2026, under issue no. 41/2026.
Abstract: Biodegradable, latex-free adhesive composition and the method thereof The present invention relates to a biodegradable, latex-free adhesive composition and a process for its preparation, derived from chemically modified polysaccharides obtained from multiple botanical sources. The adhesive comprises starches and non-starch polysaccharides sourced from Oryza sativa, Manihot esculenta, Zea mays, Solanum tuberosum, Tamarindus indica, Syzygium cumini, and mechanically processed Musa acuminata, optionally combined with proteins, plasticizers, surfactants, and antifungal agents.The adhesive is prepared by dispersing the polysaccharides in water, subjecting the dispersion to controlled thermal gelatinization, followed by limited alkaline activation to expose reactive hydroxyl groups, and subsequent acid neutralization to arrest hydrolysis and stabilize viscosity. The formulation is maintained at a neutral to mildly acidic pH to improve storage stability and preservative efficacy.Upon application and drying, the adhesive forms a hydrogen-bonded and partially entangled biopolymer network exhibiting strong adhesion to lignocellulosic and metallized substrates, making it suitable for paper bonding, lamination, packaging, and woodworking applications.
Disclaimer: Curated by HT Syndication.
