MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202647090113 A) filed by Qualcomm Incorporated on July 24, 2026, for Bandwidth Part (bwp) Operation In Subband Full Duplex (sbfd).
Inventors include Sharma, Prashant; Ryu, Jae Ho; and Abdelghaffar, Muhammad Sayed Khairy.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: Aspects of the disclosure are directed to method and techniques for wireless communications between wireless nodes via subband full-duplex (SBFD) resources and non-SBFD resources. In some examples, the wireless nodes may communicate using coupled bandwidth parts (BWPs) of varying bandwidth to accommodate downlink and uplink communications during SBFD resources.
Disclaimer: Curated by HT Syndication.
