MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617058157 A) filed by Nippon Steel Corporation on May 07, 2026, for Automobile Side-Module.
Inventors include Kubo Masahiro; Kimoto Naoki; Shirakami Satoshi; Yoshida Hiroshi; Ikegami Kenta; Fujita Soshi; Suzuki Yuki; Tabata Shinichiro; Maeda Daisuke; Toda Yuri; Fujinaka Shingo; Maki Jun; Irikawa Hideaki; and Iguchi Keinosuke.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: This automobile side-module is for reinforcing side outers of an automobile and is formed through hot-stamp molding of a plurality of integrated steel sheets. When S (m2) represents the minimum circumscribed rectangular area when viewed from the perpendicular direction of a reference plane, W0.2 (kg) represents the total weight of components each having a weight of 0.200 kg or more and W510 represents the total weight of components in each of which the minimum value of the Vickers hardness is HV510 or more among components of the automobile side-module, W0.2/S is 7.7 or less, and W510/W0.2 is more than 0.10.
Disclaimer: Curated by HT Syndication.
