MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202541025409 A) filed by Jain Deemed-To-Be University on March 20, 2025, for Automated Wooden Chips Packaging Device.
Inventor includes Vinay Kumar S B.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: An automated wooden chips packaging device, comprising an inverted U- frame 101 positioned on a ground surface having a pair of tripod-like supporting structures 102 at ends for supporting frame 101 on surface, a display panel 103 arranged on frame 101 for taking user’s input regarding quantity of wooden chips to be packed, an imaging unit 104 to determine positioning of a heap of wooden chips, multiple wheels 105 to move frame 101 over heap of wooden chips, a cylindrical barrel 106 arranged at center portion with an expandable pulley arrangement integrated in barrel 106 for tightly securing heap within barrel 106, a telescopically operated bar 108 for positioning a roller 109 assembled with bar 108 in proximity to base portion of barrel 106 to rotate through a motorized circular sliding unit 110 for uncoiling a meshed fabric for compactly packaging wooden chips.
Disclaimer: Curated by HT Syndication.
