MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202531029350 A) filed by Siksha O Anusandhan Deemed To Be University on March 27, 2025, for Automated Wire Shaping Device.
Inventor includes Dr. Tapasmini Sahoo.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: An automated wire shaping device, comprises of a platform 101 having a pair of holding unit 102 to accommodate a spool of wire, a touch interactive display panel 103 user provide input command for shaping wire, an imaging unit 104 detect a free end of the wire in the spool, a first robotic gripper 105 acquire grip on wire free end to pass through a hollow tubular structure 106, a heating unit generate heat for increasing ductility of the wire, a second robotic gripper 109 to grip free end of the heated wire and pass between a pair of circular discs 107, plurality of pneumatic pins 110 to extend/retract in accordance to specifications, a direct current motor coupled to rotate the disc 107 that the heated wire is pressed by pneumatic pins 110 at specific points for forming a consistent woven shaped wire.
Disclaimer: Curated by HT Syndication.
