MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202541029245 A) filed by Jain Deemed-To-Be University on March 27, 2025, for Automated Wire Labelling Device.
Inventor includes Vinay Kumar S B.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: An automated wire labelling device, comprises of a platform 101 positioned on a ground surface with a chamber 102 stored with various label stickers, a touch interactive display panel 103 to give input regarding labelling of a wire with label stickers, an imaging unit 104 determines presence of wire accommodated on platform 101, a pair of robotic arms 105 to grip wire and change position of wire to apply member 107 on wire in sequential manner for labelling wire with sticker, a motorized clamp 106 to grip label stickers from chamber 102 to place over a V-shaped member 107, a suction unit 108 to adhere sticker over the member 107, a motorized slider 109 to translate member 107 towards gripped wire, a heating element to partially melt sticker, a motorized pivot joint 110 to converge member 107 to attach free end of sticker with each other.
Disclaimer: Curated by HT Syndication.
