MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202541020428 A) filed by Sathyabama Institute Of Science And Technology Deemed To Be on March 06, 2025, for Automated Tape Wrapping Device For Wires.
Inventor includes Dr. Ramesh Babu A.
The application for the patent was published on September 11, 2026, under issue no. 37/2026.
Abstract: A automated tape wrapping device for wires comprising a platform 101 configured for wire wrapping, featuring suction cups for secure mounting on a fixed surface, a touch interactive display panel 102 for user input on desired wire length, a tray for wire accommodation, a first and second motorized clamps 103, 104, and a robotic arm 106 to grip and position the wire, an AI-based imaging unit 107 to capture images and determine wire dimensions, guiding a microcontroller to cut the wire to the specified length, a motorized cutter 110 and adhesive tape system for precise cutting and wrapping, a motorized roller 201 to unroll tape, and a circular slider 204 to ensure accurate tape application, plurality of primary and secondary pop-out balls 108, 109 to assist in wire translation, ensuring uniform tape coverage over the desired length of wire.
Disclaimer: Curated by HT Syndication.
