MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202541030957 A) filed by Jain Deemed-To-Be University on March 29, 2025, for Automated Soil Hole Carving And Seed Planting Device.
Inventor includes Naveen Kumar R.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: An automated soil hole carving and seed planting device, comprises of a platform 101 positioned over a ground surface of an agricultural field, a pair of track wheels 102 for maneuvering the platform 101 over the surface, an imaging unit 103 to generate a three-dimensional (3-D) map of surrounding, a touch interactive display panel 104 mounted on the platform 101 for enabling a user to select an area from the mapping, an L-shaped telescopically operated rod 105 configured with a hydraulic bar 106 to apply force for carving holes in the surface equipped with a curved-shaped member 107 equipped with plurality of pneumatic pins 108, a depth sensor for detecting depth of the holes, a LiDAR for detecting distance of the surface from the member 107, a moisture sensor for detecting moisture level of the surface.
Disclaimer: Curated by HT Syndication.
