MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202541030960 A) filed by Jain Deemed-To-Be University on March 29, 2025, for Automated Heat Shrinking Wrapping Device.
Inventor includes Chaluvaraju. Pp.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: An automated heat shrinking wrapping device comprises of, a platform 101 configured to positioned over a ground surface and installed with a chamber 102 stored with multiple size of shrink film sheet, a touch interactive display panel 103 is integrated with platform 101 to give input commands regarding wrapping, an imaging unit 104 integrated with platform 101 in synchronization with a laser sensor to detect presence and dimension of object, a multiple motorized wheels 105 integrated underneath platform 101 to move platform 101, an articulated robotic arm 106 installed with platform 101 to grip object, a pair of motorized gripper 107 installed with platform 101 to grip a shrink film sheet, a heating gun 108 installed with platform 101 via a robotic clipper 109 to position heating gun 108 in proximity of sheet to apply appropriate amount of warm air to shrink film sheet with object.
Disclaimer: Curated by HT Syndication.
