MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202531027756 A) filed by Siksha O Anusandhan Deemed To Be University on March 25, 2025, for Automated Expansion Joint Filling Device.
Inventor includes Dr. Shakti Prakash Jena.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: An automated expansion joint filling device, comprising a body 101 with a touch interactive display panel 102 to input regarding filling of expansion joints of staircase of a premise, an imaging unit 103 determine positioning of expansion joints, a pair of motorized track wheels 104 move body 101 towards expansion joints, an ultrasonic sensor determine dimensions of a particular expansion joint, a pair of motorized grippers 105 position a compressible band onto a platform 107, a laser measurement sensor determine dimensions of band, a motorized dual axis lead screw 108 translate a motorized first gripper with a blade 109 for cutting band, a motorized second gripper with a grinding wheel 110 performs grinding over surface, a nozzle 111 integrated on a container dispense an appropriate amount of adhesive over surface, and a motorized third gripper with a plate 112 spread dispensed adhesive over surface.
Disclaimer: Curated by HT Syndication.
