MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202531030522 A) filed by Siksha O Anusandhan Deemed To Be University on March 28, 2025, for Automated Device For Wrapping Pipe Bundle.
Inventor includes Dr. Tapaswinee Das.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: An automated device for wrapping pipe bundle comprises of a platform 101 positioned on a fixed surface having plurality of suction cups 102 to secure platform 101, a touch interactive display panel 103 to provide input command regarding wrapping of a bundle of pipes with protective sheet and notify user regarding weight of bundle, an imaging unit 104 to detect placement of a bundle of pipe, an inverted U-shaped frame 105 with a pair of robotic grippers 106 to grip bundle, a pair of holding unit 108 to secure an end of sheet on an end of bundle for covering bundle, a motorized roller 109 unwraps sheet in accordance to evaluated length, a RPM sensor monitors length of unwrapped sheet, a robotic link 111 cuts sheet via a motorized cutter 110, a chamber 112 to store plurality of adhesive patches to secure end of sheet, to prevent unraveling of sheet.
Disclaimer: Curated by HT Syndication.
