MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088615 A) filed by Leybold Dresden Gmbh on July 21, 2026, for Attachment Mechanism For Two-Stage Cold Head.
Inventors include Kossev, Iordan; Nuetzel, Richard; and Hampel, Michael.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: An attachment mechanism for connecting a first stage displacer of a two-stage cold head to a second stage displacer of the two-stage cold head. The attachment mechanism comprises a plug that is attachable to an end of the first stage displacer. The plug comprises a recess for receiving an end of the second stage displacer. The attachment mechanism further comprises a holding means which is configured to be mounted at least partially around the end of the second stage displacer and retain the end of the second stage displacer within the recess of said plug by engaging at least one formation extending from a radially outer surface of the second stage displacer. The attachment mechanism further comprises means for securing the holding means to the plug.
Disclaimer: Curated by HT Syndication.
