MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202617068697 A) filed by Endresshauser Flowtec AG on June 01, 2026, for Assembly For High-Frequency Field Devices, High-Frequency Field Devices, And Measuring Location.
Inventors include Wegner, Christian; Pflger, Stefan; and Rufer, Heinz.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: The invention relates to an assembly comprising: a coaxial plug connector (21) comprising an inner conductor (22), a surrounding outer conductor (23), a socket (24) which has an end face (25) and multiple spacers (26); and a printed circuit board (11) with a galvanically isolated conductor path (12) and conductor structure (13), multiple connection surfaces (14, 15), and shielding elements (32); wherein the inner conductor (22) and the conductor path (12) are electrically connected, the outer conductor (23) and the conductor structure (13) are electrically connected, the socket (24) is integrally bonded to the outer conductor (23), each spacer (26) protrudes from the end face (25) and is molded onto the socket (24), the coaxial plug connector (21) is arranged on the printed circuit board (11), each spacer (26) is integrally bonded to a first joint location (14), and a gap (31) is formed between the end face (25) of the socket (24) and the printed circuit board (11). Each shielding element (32) is positioned with a space between two adjacent spacers (26) and is integrally bonded to both the socket (24) as well as to one of the second connection surfaces (15).
Disclaimer: Curated by HT Syndication.
