MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202614003250 A) filed by Bhler Wafer Solutions Gmbh on January 12, 2026, for Arrangement And Oven For Producing Wafers.
Inventors include Kalss, Georg; and Lindner, Michael.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: The invention relates to a method, arrangement, and oven for producing wafers in heated overpressure baking molds (2) conveyed through the oven on an endless conveyor (20), comprising: - a baking plate (3) which has a baking surface (4) on one of its sides and a rear surface (5) on its opposite side, 10 - and an induction heater (6) for heating a passing baking plate (3) via the rear surface (5) thereof, - wherein the rear surface (5) of the baking plate (3) has a profile (8) that deviates from a plane, - wherein the induction module has a contour (7) that deviates from the 15 profile (8) of this rear surface (5), - wherein the profile (8) and the contour (7) are designed such that an inductor gap (10) having a variable gap distance (26) is kept clear between the rear surface (5) and the induction heater (6), - and in that regions that are heated differently are formed on the baking plate (3).
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