MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202614002230 A) filed by Bhler Wafer Solutions on January 08, 2026, for Arrangement, Baking Oven And Method For Producing Wafers.
Inventors include Kalss, Georg; Miller, Karl; and Steinbck, Michael.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: Method, arrangement and baking oven for producing wafers in heated overpressure baking moulds (2) conveyed through the baking oven on an endless conveyor (20), comprising: - a baking plate (3) having a baking surface (4) on one of its sides for delimiting one of the overpressure baking moulds and a back surface (5) on its opposite side, - and an induction heater (6) with a heating module for heating a passing baking plate (3) via its back surface (5), - wherein the back surface (5) of the baking plate (3) has a profile (8) that deviates from a plane, - wherein the induction heater (6) has a non-linear contour (7) that is adapted to this back surface (5) following the curve of the profile (8) and, in particular, replicating it, - and wherein the profile (8) and the contour (7) are designed such, that an inductor gap (10) with a constant gap distance (26) is maintained between the passing back surface (5) of the baking plate (3) and the induction heater (6).
Disclaimer: Curated by HT Syndication.
