MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202647099494 A) filed by Tetra Laval Holdings & Finance S. A. on August 18, 2026, for Apparatus For Applying A Sealing Strip Of A Heat-Sealable Material To A Web Of Packaging Material, Packaging Machine For Forming Sealed Packages And Method For Applying A Sealing Strip Of A Heat-Sealable Material To A Web Of Packaging Material.
Inventors include Ricco', Marco; Borasi, Gabriele; and Esposito, Giuseppe.
The application for the patent was published on August 28, 2026, under issue no. 35/2026.
Abstract: There is described a strip application apparatus (12) for applying a sealing strip (13) of a heat-sealable material onto a web (4) of packaging material, the strip application apparatus (12)comprising a strip sealing device (19) configured to seal a longitudinal portion (13A) of the sealing strip (13) to a longitudinal edge (4A) of the web (4) of packaging material, and a control apparatus (CA) configured to determine the position of the strip sealing device (19) with respect to a longitudinal border (4*) of the web (4) of packaging material; the a control apparatus (CA) having a reference marker (38) connected to the strip sealing device (19), an imaging device (34) arranged in a fixed position with respect to the longitudinal border (4*) and configured to acquire at least one image of the longitudinal border (4*) and of the reference marker (38) and a control unit (CU) connected to the imaging device (34) and configured to determine a transversal distance (D) between the reference marker (38) and the longitudinal border (4*) and to evaluate a correct position of the strip sealing device (19) with respect to the longitudinal border (4*) as a function of the transversal distance (D).
Disclaimer: Curated by HT Syndication.
