MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202621060158 A) filed by Visvesvaraya National Institute Of Technology Nagpur on May 12, 2026, for An Ultrathin Foam-Filled Honeycomb Sandwich Panel For Blast Load Mitigation.
Inventors include Goel, Manmohan Dass; Shirbhate, Payal A.; and Chopdey, Manoj.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The present invention discloses an ultrathin foam-filled honeycomb sandwich panels for blast load mitigation. This lightweight blast-resistant sandwich panel comprising ultrathin stainlesssteel facesheets and a honeycomb core optionally filled with polyurethane (PU) foam. The panel is designed as a passive sacrificial device to absorb and dissipate high-intensity blast energy. In preferred embodiments, the panel has plan dimensions of 300 mm × 300 mm, with SS-304 facesheets of 1 mm thickness and a core made from aluminum or high-strength paper honeycomb of height between 25–100 mm. The polyurethane foam filler, with density of 25 kg/m³, enhances energy dissipation by strain-rate sensitive compression, significantly reducing backsheet deformation. The core is bonded to the facesheets using high-strength epoxy adhesive. Field blast (702) tests conducted using 30.4 g TNT explosive charge at a 150 mm stand-off distance under fixed boundary condition (701) demonstrated superior performance of foam-filled honeycomb cores compared to empty cores. The invention provides a modular, retrofittable protective structure suitable for defense, aerospace, and civil infrastructure applications.
Disclaimer: Curated by HT Syndication.
