MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202621069346 A) filed by Symbiosis International Deemed University on June 02, 2026, for An Integrated Snack Packaging System With An Edible Dip Tray And Reusable Cylindrical Canister.
Inventors include Dr. Manohar Desai; Prof. Nitin Gawai; Ranjit Jagtap; and Hanshika Jain.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: ABSTRACT AN INTEGRATED SNACK PACKAGING SYSTEM WITH AN EDIBLE DIP TRAY AND REUSABLE CYLINDRICAL CANISTER The present invention discloses an integrated snack packaging system (100) comprising a cylindrical outer canister (110) with internal longitudinal slide rails (160), a slidable edible dip tray (120) fabricated from a baked flour-based substrate and carrying a solidified dip layer (122) on its upper surface, a plurality of stackable snack chips (130) arranged on the edible dip tray (120), a removable lid (140), a reusable base cap (150), and a printed paper sleeve (180) with a flavour-coded colour band (170). The edible dip tray (120) engages the slide rails (160) via its peripheral edge (121) and is smoothly extractable by the consumer upon lid removal. A moisture barrier separator (131) prevents moisture migration from the dip layer (122) to the chips (130) during storage. Upon consumption of the chips (130), the consumer eats the edible dip tray (120), thereby generating zero packaging waste from the dip component. The canister (110) is reusable post-consumption. The invention eliminates the need for separate dip containers, reduces plastic waste, and delivers an interactive, guided chip-and-dip snacking experience in a single unified packaging unit. [
Disclaimer: Curated by HT Syndication.
