MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088701 A) filed by Qualcomm Incorporated on July 21, 2026, for An Integrated Circuit Device Including A Multi-Chip Package.
Inventors include Lan, Je-Hsiung; Kim, Jonghae; and Dutta, Ranadeep.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: A multi-chip package includes a first chiplet (120A) including power amplifier (PA) (108) circuitry. The multi-chip package also includes a second chiplet (120B) including low-noise amplifier (LNA) circuitry (110). The multi-chip package further includes an electromagnetic interference (EMI) shield (106) between the first chiplet and the second chiplet. The multi-chip package also includes mold compound (104) at least partially encapsulating the first chiplet, the second chiplet, and the EMI shield.
Disclaimer: Curated by HT Syndication.
