MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202641106529 A) filed by Intessence Solutions Private Limited on September 03, 2026, for An Implant Assembly.
Inventors include Hariprasad Kudpi Rao; and Annappa Muttappa Attigeri.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: ABSTRACT “AN IMPLANT ASSEMBLY” An implant assembly having a localized fit-defining connection is disclosed. A first implant component has a first connection portion and a second implant component has a second connection portion movable relative thereto from an entry position to a seated position. One connection portion may define a cavity having an internal mating surface. At least one microprojection extends inwardly from the internal mating surface around at least part of its perimeter at a predefined axial location. A predefined projection height establishes a predetermined clearance fit, interference fit, or combination thereof with a mating projecting portion. The connection may have circular, elliptical, polygonal, planar, curved, or mixed transverse profiles. A sealing interface is formed at the seated position and may be axially spaced from the microprojection. Dental embodiments include implant fixtures, straight or angled abutments, multi-unit abutments, intermediate prosthetic members, prosthetic support members, and optional locking screws.
Disclaimer: Curated by HT Syndication.
