MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202441101391 A) filed by Stellantis Auto Sas; and Fca Us LLC on December 20, 2024, for An Immersion Cooling System For Automobile Printed Circuit Board Assembly (pcba).
Inventors include Ravinder Singh; Shivaprasada Kv; Manish Kumar; and Naresh Dalal.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: The invention relates to an immersion cooling system (100) for automobile Printed Circuit Board Assembly (PCBA). The system includes a reservoir (105) designed to house at least one PCBA (103) submerged in a non-conductive dielectric liquid (104). An inlet (101) being provided at the bottom of reservoir housing (105a) supplies the dielectric liquid (104) to immerse the PCBA (103), while an outlet (102) discharges the liquid after heat absorption. A heat exchanger (106) is in fluid communication with the outlet (102) and facilitates the transfer of heat from the dielectric liquid (104) exiting the reservoir. A pump (107) recirculates the cooled dielectric liquid back into the reservoir (105). The system effectively manages heat dissipation for automobile PCBAs using a non-conductive dielectric liquid in a closed-loop setup, ensuring optimal temperature control. The system (100) enhances thermal management, improves component lifespan, and offers cost-effectiveness, reliability, and safety. [Relevant Figures – 1 and 2]
Disclaimer: Curated by HT Syndication.
