MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202611092685 A) filed by Indian Institute Of Technology Delhi on July 30, 2026, for An Auxetic Architected Sandwich Panel For Blast Load Dissipation.
Inventors include Saikat Sarkar; Kartik Mishra; and Arjun Kaithavalappil.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: The present subject matter discloses an auxetic architected sandwich panel (102). The auxetic architected sandwich panel (102) includes a plurality of face sheets (104a, 104b). The auxetic architected sandwich panel (102) includes a Thermoplastic Polyurethane (TPU) core sandwiched between the plurality of face sheets (104a, 104b). The TPU core (106) includes a plurality of primary voids (106a), and a plurality of secondary voids (106b) smaller in size in comparison to the plurality of primary voids (106a). The plurality of secondary voids (106b), and the plurality of primary voids (106a) are arranged in hierarchical manner to induce an auxetic deformation mechanism thereby facilitating a stress redistribution and an enhanced blast energy dissipation when the auxetic architected sandwich panel (102) is subjected to a blast load. [[FIGS. 1]]
Disclaimer: Curated by HT Syndication.
