MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202621084601 A) filed by Dr. Vishwanath Karad Mit World Peace University on July 09, 2026, for An Assembly For Thermal Management.
Inventors include Soham Shrikant Joshi; Atharv Narendra Soni; Anuj Jitendra Rathod; and Kaustubh Ganesh Kulkarni.
The application for the patent was published on August 28, 2026, under issue no. 35/2026.
Abstract: ABSTRACT AN ASSEMBLY FOR THERMAL MANAGEMENT The present disclosure provides an assembly (100) for thermal management of one or more heat-generating electronic devices. The assembly (100) comprises a vapor chamber assembly (112) comprising an evaporator section and a condenser section enclosing a working fluid. One or more phase change material compartments are thermally coupled to the vapor chamber assembly (112) and accommodate a plurality of phase change materials arranged in a cascaded configuration to sequentially absorb thermal energy. A hybrid wick structure disposed within the vapor chamber assembly (112) comprises a first wick structure and a second wick structure having different capillary forces to facilitate return of condensed working fluid. One or more grooves formed on the evaporator section facilitate heat transfer and vapor generation. The assembly (100) transfers and dissipates thermal energy, thereby maintaining continuous passive thermal management under transient thermal loading and variable-gravity operating conditions.
Disclaimer: Curated by HT Syndication.
