MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202641094153 A) filed by Anurag University on August 04, 2026, for An Ai-Powered Platform For University Placements.
Inventors include S. Sai Vara Prasad; Y. Suguna; Dr. M. Sridevi; and T. Venkata Subbamma.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: ABSTRACT The present invention relates to an AI-powered platform for university placements (100) that facilitates intelligent career development and placement management through an integrated digital architecture. The platform comprises a student portal (102), an administrator console (104), a corporate recruiter portal (106), a backend service layer (108), an authentication and security module (110), an artificial intelligence engine (112) including a resume analysis module (114), an interview assessment module (116), an agentic job discovery module (118), a smart match scoring module (120), a document verification module (122), a database (124), and a cloud storage repository (126). The platform is configured to perform AI-based resume analysis, candidate evaluation, intelligent job recommendation, automated document verification, and placement analytics while enabling secure interaction among students, administrators, and recruiters. The integrated architecture further supports experience point (XP)-based career progression and invention disclosure management, thereby improving placement efficiency, reducing administrative effort, enhancing candidate-job compatibility, and providing a secure, scalable, and intelligent university placement ecosystem. The figure associated with the abstract is Fig. 1.
Disclaimer: Curated by HT Syndication.
