MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202617043124 A) filed by Uacj Corporation on April 04, 2026, for Aluminum Alloy Structure, Thermal Bonding Method, And Aluminum Alloy Extruded Material And Method For Producing Same.
Inventors include Tomori Ryo; Suzuki Taichi; and Nakagawa Ryogo.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: Disclosed is an aluminum alloy structure which is obtained by thermally bonding one member to be bonded and the other member to be bonded, the aluminum alloy structure being characterized in that: the one member to be bonded contains 1.80-3.00 mass% of Si, 0.10-1.60 mass% of Mn, and 0.01-0.70 mass% of Fe, with the balance being made up of Al and unavoidable impurities; the average crystal grain size in the outermost layer of the one member to be bonded at the bonded part of the one member to be bonded and the other member to be bonded is 200 µm or less; and the average crystal grain size is 400 µm or more in a cross-section at a depth of 100 µm of a portion that has the smallest width in the one member to be bonded. The present invention makes it possible to provide an aluminum alloy structure, and an aluminum alloy extruded material and a method for producing the same, the aluminum alloy structure enabling simplification of the manufacturing process by being able to be bonded in the form of a single layer. The aluminum alloy structure exhibits good bondability and is able to be suppressed in deformation during thermal bonding.
Disclaimer: Curated by HT Syndication.
