MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617057503 A) filed by International Business Machines Corporation on May 06, 2026, for Air Gap Structure In Interconnect With Top Via.
Inventors include Dutta, Ashim; Luedders, Katherine; and Yang, Chih-Chao.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: A back-end-of-the-line (BEOL) interconnect structure is provided that includes a top via structure located on a metal line. An air gap is located adjacent to, and around, the metal line and top via structure. This air gap includes a lower portion adjacent to the metal line and an upper portion adjacent to the top via structure. Such an air gap can extend BEOL interconnect scaling for 2 nm technology node and below. Methods of forming such an BEOL interconnect structure are also provided.
Disclaimer: Curated by HT Syndication.
