MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202621069888 A) filed by Symbiosis International Deemed University on June 03, 2026, for Ai-Powered Student-To-Industry Transition Intelligence Platform With Integrated Skill Gap Analysis And Placement Prediction System.
Inventors include Dr. Nikhil Mangrulkar; Divyanka Chakole; Disha Devgirkar; and Yashashvi Bisen.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: ABSTRACT AI-POWERED STUDENT-TO-INDUSTRY TRANSITION INTELLIGENCE PLATFORM WITH INTEGRATED SKILL GAP ANALYSIS AND PLACEMENT PREDICTION SYSTEM The present invention discloses an artificial intelligence- powered Student-to-Industry Transition Intelligence Platform (100) that bridges the gap between academic preparation and industry expectations. The platform (100) comprises a frontend user interface module (110) for student data input, backend processing server (120) for coordinating system operations, placement prediction module (130) employing logistic regression for computing placement readiness probability scores, skill gap analysis module (140) utilizing TF-IDF vectorization and cosine similarity for comparing student competencies against industry requirements, an external skill verification module (150) interfacing with code repository APIs for independent skill validation, a recommendation engine (160) generating personalized suggestions for courses, certifications, and projects, a database module (170) for persistent data storage, and an interactive dashboard module (180) for visual presentation of results. The platform integrates machine learning, natural language processing, and external data verification within a unified web- based system to provide comprehensive student industry-readiness assessment and actionable improvement guidance. [
Disclaimer: Curated by HT Syndication.
