MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202641124875 A) filed by Sns College Of Technology on October 07, 2026, for Ai-Powered Student Externship And Work Experience Platform.
Inventors include S. Vijayalakshmi; G; Abinesh. S; Kamalesh. M; Dharun J; Navaneethan S; Dhinesh S; Elakkiya M; Elayakanikaa T; and Mugeshraj B.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: This development introduces an AI-Powered Full Stack Web Platform for Connecting Students with Real-World Work Experiences and Externship Opportunities through Intelligent Skill-Based Matching. Traditional methods of finding internships, externships, and real-world work experiences often depend on manual searching, generic job portals, and limited skill-based recommendations, making it difficult for students to identify suitable opportunities. The proposed system addresses these limitations through a centralized digital platform where students can create profiles, add their skills, interests, education, projects, and career preferences. An artificial intelligence-based matching module analyzes student profiles and opportunity requirements to identify suitable externship and work-experience opportunities based on skills, interests, qualifications, and preferences. The generated recommendations are stored in a centralized database along with student and opportunity details. An administrative interface enables authorized personnel to manage student profiles, organizations, opportunities, applications, and platform activities. The system provides an intelligent and structured approach to connecting students with relevant real-world learning and career opportunities.
Disclaimer: Curated by HT Syndication.
