MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202621064515 A) filed by Ayush Sunil Khairnar; Dr Nitin Borse; Raghav Kulkarni; Neha Kshirsagar; Aditi Kulkarni; and Dr Nishant Kulkarni on May 22, 2026, for Ai Data Center Cooling And Thermal Management System.
Inventors include Ayush Sunil Khairnar; Dr Nitin Borse; Raghav Kulkarni; Neha Kshirsagar; Aditi Kulkarni; and Dr Nishant Kulkarni.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: A thermal management system designed to efficiently cool Artificial Intelligence (AI) data centers and high-performance computing systems using twisted tape assisted swirl-flow cooling. The system comprises a liquid immersion cooling chamber (I) that cools AI servers and GPU systems through a coolant circulation assembly (II). A twisted tape insert mechanism (III) positioned inside the coolant circulation tube generates helical coolant motion and secondary vortices, thereby increasing turbulence intensity and improving convective heat transfer performance. A swirl-flow enhancement mechanism (IV) continuously disrupts the thermal boundary layer and improves coolant mixing for enhanced thermal energy transport. A thermal energy dissipation system (V) removes heat from high-density AI computing hardware, while a monitoring and control system (VI) regulates coolant flow and thermal stability. The overall structural housing assembly (VII) supports the immersion cooling architecture and maintains stable thermal operation under continuous high computational loads. The proposed cooling system provides improved cooling uniformity, reduced hotspot formation, enhanced thermal stability, and higher heat transfer capability compared to conventional evaporative cooling systems, making it suitable for next-generation AI data center applications.
Disclaimer: Curated by HT Syndication.
