MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202647066422 A) filed by Qualcomm Incorporated on May 26, 2026, for Aggregated Capability Signaling For Carrier Aggregation And Dual Connectivity Modes.
Inventors include Han, Bin; Kitazoe, Masato; Agrawal, Mona; and Cao, Yiqing.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may transmit an aggregated capability message for communications between the UE and a network entity via a set of component carriers. Further, the aggregated capability message may indicate a total processing capability of the UE for the set of component carriers. In addition, the UE may receive scheduling information in accordance with the aggregated capability message for the communications between the UE and the network entity via one or more component carriers of the set of component carriers. Thus, the UE may communicate with the network entity via the one or more component carriers in accordance with the scheduling information received from the network entity.
Disclaimer: Curated by HT Syndication.
