MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202641063562 A) filed by Peri Institute Of Technology on May 20, 2026, for Advanced Pcm Embedded Protective Case For Mobile Thermal Management.
Inventors include Mr. Vigneshwaran D; Dr. Rafi Ahamed S; Mr. Teku Naresh; Mr. Pradeesh S; Ms. Dharani V; and Mr. Dharvin Guru T K.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: A novel Phase Change Material (PCM) Integrated Thermal Management Case for the mobile phone is disclosed which is used to reduce excessive heat generation during continuous operation of the mobile phone. With today's mobile phones, significant heat is generated during long gaming sessions, video streaming, charging and high performance processing which can shorten battery life, impair electronic components, hampers device function, and in extreme cases, may result in overheating dangers or explosions. A desired object of the proposed invention is to provide a detachable or integrated mobile phone protective case with a particular selected combination of PCM layers that has the ability to absorb and store additional thermal energy generated by the cell phone. As the temperature of the mobile phone comes to exceed a set value, the PCM changes its phase from solid to liquid, and absorbs latent heat without increasing the mobile phone surface temperature by much. This passive cooling method allows to maintain an operation temperature of the mobile device that is lower without consuming additional power. The PCM module can incorporate thermal storage chambers that are encased in a shell, nano-enhanced conductive materials, flexible heat-spreading layers, activation regions which respond to temperature, and interchangeable PCM cartridges for re-use. The system may be engineered to control the temperature automatically with different atmospheric conditions and user's operating patterns. The invention reduces thermal stress, thus extending the life of mobile phones, battery safety, processing stability and user comfort. The proposed technology offers a lightweight, energy efficient, reusable and economical thermal protection system for smartphones, tablets, gaming devices and other portable electronic systems
Disclaimer: Curated by HT Syndication.
