MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202521015310 A) filed by Rungta International Skills University; Rungta College Of Engineering & Technology; and Rungta College Of Pharmaceutical Sciences And Research on February 22, 2025, for Advanced Multi-Modal Wound Healing Device For Diabetic Care And Monitoring.
Inventors include Shweta Pandey; Harsh Sharma; Shubham Chouhan; Suraj Kumar; Ripu Barik; Himanshu Kumar Sinha; Manish Kumar; Ankit Kumar Mishra; and Yash Pratap Singh.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: Advanced Multi-Modal Wound Healing Device for Diabetic Care and Monitoring This invention describes an advanced medical device tailored to the unique challenges of diabetic wound care. This comprehensive system integrates multiple therapeutic modalities, including electrostimulation to enhance microvascular circulation, controlled oxygenation to optimize cellular metabolism, and a bioactive hydrogel layer containing antimicrobial agents and growth factors to prevent infection and accelerate tissue regeneration. Embedded biosensors continuously monitor critical wound parameters, such as glucose levels, pH, and inflammatory markers, enabling real-time data collection. An AI-driven management platform analyzes this data to dynamically adjust therapeutic settings, ensuring personalized and adaptive treatment. The device features a lightweight, portable, and ergonomic design, suitable for both clinical and homecare environments, and includes a rechargeable power source and user-friendly interface. By combining therapeutic intervention with real-time monitoring and AI-driven adaptability, this invention addresses the complex needs of diabetic patients, improving healing outcomes, minimizing infection risks, and enhancing overall patient care.
Disclaimer: Curated by HT Syndication.
