MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202531021755 A) filed by Zephyros, Inc. on March 11, 2025, for Adhesive Enabled Three-Dimensional (3-D) Thermo-Formed High Temperature Thermal Management Solution.
Inventors include Taxak, Manish; and Hatkar, Vinod.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: A material including a substrate having a plurality of layers, with one or more layers including one or more inorganic materials, and a three-dimensional forming enabler including one or more high temperature adhesives applied to one or more surfaces of the substrate. The material may be compressed with temperature and pressure to form a monolithic structure capable of being formed into three-dimensional shapes.
Disclaimer: Curated by HT Syndication.
