MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617055420 A) filed by Vanchip Tianjin Technology Co. , Ltd. on April 30, 2026, for Acoustic Surface Wave Filter Packaging Structure And Manufacturing Method Therefor.
Inventors include Yu, Caixiang; Peng, Yanjun; Hong, Shengping; Lin, Hongkuan; and Zhou, Bin.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: The present invention provides an acoustic surface wave filter packaging structure and a manufacturing method therefor. An annular metal wiring structure formed on a base and an annular metal pad formed on a substrate are connected to form a retaining wall structure so as to achieve injection molding isolation, thereby achieving high stability and reliability. Additionally, the annular metal wiring structure is formed on the base, the annular metal pad is formed on the substrate, and the annular metal wiring structure and the annular metal pad both have simple structures, thereby reducing the process difficulty and manufacturing costs.
Disclaimer: Curated by HT Syndication.
