MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202641088277 A) filed by T. Ragavi on July 20, 2026, for Accordioz-An Integrated Retractable Headphone Assembly For Mobile Communication Devices And Gadgets.
Inventor includes T. Ragavi.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: An integrated retractable headphone assembly for a mobile communication device (10) 5 comprises a compartment (20) formed in a rear panel (14) of the device housing, closed by a sliding lid (24). A spring-loaded retraction reel (30), disposed within the compartment (20),carries a headphone cable (50) of oxygen-free tinned- copper TRRS construction, routed through an internal channel (60), protected by an aerogel thermal-barrier layer (70), and permanently connected to an internal audio- jack connector (80). A pair of earbuds (40), each 10 having a dynamic driver (42) and a replaceable ear tip (44), is releasably retained within the compartment (20) by a magnetic locking formation (32), and a MEMS microphone (55) mounted on the cable (50) provides hands-free call capability. The headphone assembly is constructed as a modular, repair-friendly unit permanently integrated within the mobile device housing, whereby the device and its headphone accessory no longer exist as separate, 15 independently managed articles, while retaining the audio quality, latency and reliability characteristic of wired audio transmission.
Disclaimer: Curated by HT Syndication.
